Preparation for the official unveiling of the Lenovo Legion Y70 gaming phone continues to catch on, and it looks like it will likely take place very soon.
Prior to the August 18 event , the company had previously released some details on its latest flagship. Lenovo further introduces the model by releasing details on the cooling mechanism of the Lenovo Legion Y70 gaming smartphone .
The Legion Y70 will have a 5.047 sqmm vapor chamber with a thickness of 0.55mm, the thickness of the profile is quite thin while the base has an overall thickness of 0.8mm without its camera, furthermore the Legion Y70 is equipped with a 50MP protruding camera with OIS, and there are 10 layers of heat dissipation mechanisms and materials that provide excellent cooling for the device.
As we know, the Legion Y70 is designed with solid credentials for gaming, but it also has an attractive design that suits even the average customer, and while some gaming components such as the triggers on the top sides and a game-centric user interface are absent, the phone is well prepared for gaming with its Snapdragon 8+ Gen 1 SoC , 16GB of RAM and support for 68W fast charging.
The device’s excellent cooling mechanism also adds to the mix to make it a worthy purchase. More details will come as we get closer to the official presentation of the Lenovo Legion Y70.
- Lenovo teases the Legion Y70 gaming phone’s “superb” cooling mechanism (Gizmochina)